T. Krems

Millimeter-wave performance of chip interconnections using wire bonding and flip chip

T. Krems, W.H. Haydl, H. Massler et al. · 2002 · 162 citations

Engineering, Interconnect (Integrated Circuits), Electromagnetic Compatibility +18

Advantages of flip chip technology in millimeter-wave packaging

T. Krems, W.H. Haydll, Jan Rüdiger · 2002 · 41 citations

Flip Chip Technology, Engineering, Flip Chip Packages +16

Models of coplanar lines and elements over the frequency range 0-120 GHz

W.H. Haydl, A. Tessmann, K.H. Zufle et al. · 1996 · 41 citations

Electrical Engineering, Millimeter Wave Technology, Engineering +13

Single-chip coplanar 94-GHz FMCW radar sensors

W.H. Haydl, M. Neumann, L. Venveyen et al. · IEEE Microwave and Guided Wave Letters · 1999 · 32 citations

Engineering, Radio Frequency, Oscillators +21

Avoiding cross talk and feed back effects in packaging coplanar millimeter-wave circuits

T. Krems, A. Tessmann, W.H. Haydl et al. · 2002 · 31 citations

Electrical Engineering, Millimeter Wave Technology, Engineering +14