Jan Rüdiger

Millimeter-wave performance of chip interconnections using wire bonding and flip chip

T. Krems, W.H. Haydl, H. Massler et al. · 2002 · 162 citations

Engineering, Interconnect (Integrated Circuits), Electromagnetic Compatibility +18

Advantages of flip chip technology in millimeter-wave packaging

T. Krems, W.H. Haydll, Jan Rüdiger · 2002 · 41 citations

Flip Chip Technology, Engineering, Flip Chip Packages +16

VHF plasma processing for in-line deposition systems

Jan Rüdiger, H. M. Brechtel, A. Kottwitz et al. · Thin Solid Films · 2003 · 16 citations

Electrical Engineering, Engineering, Magnetohydrodynamics +6

Coplanar bond wire interconnections for millimeter-wave applications

T. Krems, W.H. Haydl, L. Verweyen et al. · 2002 · 15 citations

Electrical Engineering, Millimeter Wave Technology, Engineering +11

Compact monolithic coplanar 94 GHz front ends

W.H. Haydl, L. Verweyen, T. Jakobus et al. · 2002 · 15 citations

Electrical Engineering, Chip Size, Engineering +14