IEEE Journal of Solid-State Circuits · 1999 · 32 citations · 10 references
EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringSemiconductor DevicesHigh-frequency Semiconductor DevicesIntegrated Circuit DesignMicrowave AmplifiersMicrowave Integrated CircuitsMicrowave Semiconductor DevicesRadio-frequency Integrated CircuitsCoplanar WaveguidesMicrowave Amplifier ModelingMicrowave DevicesMillimeter-wave Integrated CircuitsMonolithic Microwave Integrated Circuit AmplifiersMonolithic Microwave Integrated Circuit DesignMonolithic Microwave Integrated CircuitsPower Amplifier Design
In this paper, we report on the development of W-band monolithic microwave integrated circuit (MMIC) power amplifiers using 0.1-/spl mu/m AlInAs/GaInAs/InP high electron mobility transistor (HEMT) technology and finite-ground coplanar waveguide (FGCPW) designs. In the device modeling, the Angelov nonlinear HEMT model was employed to predict the large signal performance of the device, and the results were validated by using state-of-the-art vector load-pull measurements. A two-stage single-ended W-band FGCPW MMIC using a 150-/spl mu/m-wide HEMT as the driver and a 250-/spl mu/m-wide HEMT for the output stage was designed, fabricated, and tested. The MMIC amplifier demonstrates a maximum output power of 18.6 dBm with 18.2% power-added efficiency and 10.6 dB associated gain at 94 GHz. This result is the best output power to date reported from an InP-based MMIC using FGCPW design at this frequency.
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30-nm-gate InAlAs/InGaAs HEMTs lattice-matched to InP substrates
Tetsuya Suemitsu, T. Ishii, Hideaki Yokoyama et al. · 2002 · 31 citations