The impact of hole-induced electromigration on the cycling endurance of phase change memory

Abstract

The high current density induced failure in Ge <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> Sb <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> Te <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</inf> (GST)-based phase change memory (PCM) is investigated. A strong dependence of cycling endurance on the polarity of the operation current is observed and reported for the first time. The cycling endurance is reduced by 4 orders of magnitude when the current polarity is reversed. Careful TEM analysis of failed cells revealed a thin void in GST over the bottom electrode, but only in the reverse polarity samples. This phenomenon can be explained by hole-induced electromigration at the electrode/GST interface. The impact of electromigration on scaled phase change memory is discussed.