Publication | Closed Access
The correlation of highly accelerated Q/sub bd/ tests to TDDB life tests for ultra-thin gate oxides
13
Citations
13
References
1998
Year
Unknown Venue
EngineeringBreakdown TestsSemiconductor DeviceNanoelectronicsUltra-thin Gate OxidesTddb Life TestsNew TechniqueElectrical EngineeringPhysicsBias Temperature InstabilityTime-dependent Dielectric BreakdownDevice ReliabilityMicroelectronicsPhysic Of FailureAcceleration ParametersStress-induced Leakage CurrentApplied PhysicsQ/sub Bd/ TestsCircuit ReliabilityBeyond CmosElectrical Insulation
A new technique is proposed to extract long-term constant voltage stress time-dependent dielectric breakdown (TDDB) acceleration parameters from highly accelerated constant or ramped current injection breakdown tests. It is demonstrated that an accurate correlation of highly accelerated breakdown tests to long-term constant voltage TDDB tests can be obtained.
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