IEEE Transactions on Components Hybrids and Manufacturing Technology · 1979 · 31 citations · 2 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDielectric CeramicsDielectricsHigh-temperature MaterialsMos CapacitorsSemiconductor Device MaterialsSilicon MaterialsCapacitorsCompatible MaterialsFabricationHigh-temperature Device OperationHigh-temperature ElectronicsResistivitySiliconSilicon Device Materials
Commercial and Sandia fabricated silicon MOSFET's, thickfill resistors and capacitors, and magnetic components were investigated in an effort to increase the versatility of microelectronics used at 300°C and to form a foundation for a higher temperature technology. Commerical MOSFET's were found susceptible to parameter drifts and have unacceptable electrical characteristics when tested at 300°C, whereas redesigned low alkali impurity devices were able to maintain stable operation at 300°C for 1000 h with improved characteristics. Thus, although MOSFET's are prone to aging, it is possible to use fabrication procedures which allow MOSFET use at high temperature. A specially developed ceramic filled, high silica frit dielectric thick-film material exhibited a sufficiently high resistivity to permit development of 300°C, 1.0 \muF capacitors. Procedures were developed to make this material compatible with the multilayer brick capacitor format which is necessary for miniaturization. Both this dielectric and a ruthenium-based resistor material were shown useful to 500°C. In addition, a spectrum of magnetic components was qualified for use at 500°C.
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The physics of semiconductor devices
R. H. Rediker · Solid-State Electronics · 1970 · 1.6K citations