<title>Self-aligned double patterning (SADP) compliant design flow</title>

Abstract

Double patterning with 193nm optical lithography is inevitable for technology scaling before EUV is ready. In general, there are two major double patterning techniques (DPT): Litho-Etch-Litho-Etch (LELE) and sidewall spacer technology, a Self-Aligned Double Patterning technique (SADP). So far LELE is much more mature than SADP in terms of process development and design flow implementation. However, SADP has stronger scaling potential than LELE due to its smaller design rules on tip-tip and tip-side as well as its intrinsic self-align property. In this paper, we will explain in detail about how to enable a SADP-friendly design flow from multiple perspectives: design constructs, design rules, standard cell library and routing. In addition, the differences between SADP and LELE in terms of design, scaling capability and RC performance will be addressed.