Study of electrical discharge machining technology for slicing silicon ingots

Investigation of silicon wafering by wire EDM

Yuxuan Luo, C. G. Chen, Zheming Tong · Journal of Materials Science · 1992 · 70 citations

Electrical Engineering, Wafer Scale Processing, Engineering +7

Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

J. Li, Imin Kao, V. Prasad · Journal of Electronic Packaging · 1998 · 46 citations

Engineering, Wire Saw, Mechanical Engineering +19

Development of a Resinoid Diamond Wire Containing Metal Powder for Slicing a Slicing Ingot

Toshiyuki Enomoto, Yutaka Shimazaki, Yasuhiro Tani et al. · CIRP Annals · 1999 · 36 citations

Materials Science, Engineering, Material Processing +5

Vibration and Deflection of a Silicon-Wafer Slicer Cutting the Crystal Ingot

Seiji CHONAN, Zhongwei Jiang, Yoshihiro Yuki · Journal of vibration and acoustics · 1993 · 16 citations

Wafer Scale Processing, Vibrations, Engineering +15

Stress Analysis of a Silicon-Wafer Slicer Cutting the Crystal Ingot

Seiji CHONAN, Zhongwei Jiang, Yoshihiro Yuki · Journal of Mechanical Design · 1993 · 13 citations

Engineering, Mechanical Engineering, Mechanics Of Materials +23