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The Influence of Surface Roughness on the Electric Conduction Process in Amorphous Ta2 O 5 Thin Films
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1999
Year
Thin Film PhysicsAmorphous Thin FilmsEngineeringThin Film Process TechnologyChemical DepositionCharge TransportSurface TechnologyThin Film ProcessingThin-film TechnologyMaterials ScienceElectrical EngineeringSurface RoughnessOxide ElectronicsThin Film MaterialsElectrical PropertySurface ScienceApplied PhysicsThin Film DevicesThin FilmsElectric Conduction ProcessAmorphous SolidElectrical Insulation
Amorphous thin films were deposited by radio‐frequency magnetron sputtering at the substrate temperatures of 100, 200, and 300°C, respectively. The electrical properties of thin films were investigated as a function of substrate temperature and film thickness. The leakage current of the films was in the order of to for an applied field of 1 MV/cm. The charge storage capacitances were 7.7 (100°C), 7.9 (200°C), and . Most of the electrical analyses were performed with the data obtained for the thin films deposited at 200°C substrate temperature because they showed optimum electrical properties. The dominant conduction mechanism changed from Schottky emission current at low field to Poole‐Frenkel current at the high field. With increasing film thickness, the surface roughness increased, whereas the transition fields from the electrode‐limited current to the bulk‐limited current process decreased. To verify the effect of this surface roughness on the electrical conduction mechanism, a two‐dimensional numerical simulator, MEDICI, was used to simulate the electric field distribution at the bulk region of the thin film and the interface region between the thin film and electrode. © 1999 The Electrochemical Society. All rights reserved.