Microstructure, electric flame-off (EFO) characteristics and tensile properties of silver–lanthanum alloy wire

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Materials Science, Various Temperatures, Electromigration Effect +6

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Z.W. Zhong · Microelectronics Reliability · 2010 · 103 citations

Materials Science, Electrical Engineering, Engineering +5

A comparison of copper and gold wire bonding on integrated circuit devices

S.L. Khoury, D.J. Burkhard, David Galloway et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 98 citations

Engineering, Device Integration, Reliability Results +16

Challenges and developments of copper wire bonding technology

Peisheng Liu, Liangyu Tong, Jinlan Wang et al. · Microelectronics Reliability · 2011 · 92 citations

Materials Science, Materials Engineering, Electrical Engineering +6

Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding

S. Murali, Narasimalu Srikanth, Charles J. Vath · Materials Characterization · 2003 · 87 citations

Materials Engineering, Materials Science, Deformation Substructures +9