Publication | Closed Access
Investigation of the degradation mechanisms of InP/InGaAs DHBT under bias stress conditions to achieve electrical aging model for circuit design
10
Citations
5
References
2011
Year
Electrical EngineeringBias Stress ConditionsEngineeringRf SemiconductorCircuit DesignBias Temperature InstabilityApplied PhysicsInp/ingaas DhbtCircuit ReliabilityElectronic PackagingDevice ReliabilityMicroelectronicsSemiconductor Device
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