Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

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<i>The Solid–Liquid Interface</i>

D.P. Woodruff, J. J. Bikerman · Physics Today · 1974 · 344 citations

Natural Sciences, Materials Engineering, Materials Science +17

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

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Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

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Progress in the design of new lead-free solder alloys

M. McCormack, Sungho Jin · JOM · 1993 · 116 citations

Natural Sciences, Materials Engineering, Materials Science +9