Integrated barrier/plug fill schemes for high aspect ratio Gb DRAM contact metallization - Concepedia

Concepedia

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Integrated barrier/plug fill schemes for high aspect ratio Gb DRAM contact metallization

14

Citations

1

References

1998

Year

Yu‐Pei Chen, Girish Dixit, Jiong-Ping Lu, Wei‐Yung Hsu, A. Konecni, J. D. Luttmer, Robert Havemann

Thin Solid Films

Materials ScienceElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)MicrofabricationInterconnect (Integrated Circuits)Chip AttachmentSemiconductor Device FabricationElectronic PackagingMicroelectronicsBarrier/plug Fill

References

	Year	Citations

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