Japanese Journal of Applied Physics · 2005 · 28 citations · 23 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsLight-emitting DiodesSemiconductor DefectsSemiconductor Device MaterialsSemiconductor HeterostructuresSemiconductor InterfacesSemiconductor PhysicsAnnealingAnnealing Temperature EffectsCurrent DensityDouble HeterostructuresElectroluminescenceHeterostructure DevicesHeterostructure MaterialsMolecular Beam Epitaxy
We have fabricated p-Si/β-FeSi 2 film/n-Si double-heterstructure (DH) light-emitting diodes (LEDs) on Si(111) substrates by molecular beam epitaxy (MBE). It was found that both the thickness of an undoped Si overlayer and subsequent annealing temperature were key parameters in preventing the aggregation of the β-FeSi 2 film and the successful formation of a Si/β-FeSi 2 film/Si DH LED on Si(111). A 1.6 µm electroluminescence (EL) was realized at room temperature (RT) at a current density higher than 78 A/cm 2 by increasing the thickness of the β-FeSi 2 active region from 90 nm to 250 nm, suggesting that there exist numerous defects at Si/β-FeSi 2 heterointerfaces.
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A silicon/iron-disilicide light-emitting diode operating at a wavelength of 1.5 μm
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