Publication | Closed Access
Influence of positive bias stress on N2O plasma improved InGaZnO thin film transistor
171
Citations
16
References
2010
Year
Materials SciencePositive Bias StressElectrical EngineeringBias StressEngineeringN2o PlasmaNanoelectronicsBias Temperature InstabilityOxide ElectronicsApplied PhysicsParasitic TransistorMicroelectronicsN2o-plasma TreatmentOptoelectronicsSemiconductor Device
A post-treatment using N2O-plasma is applied to enhance the electrical characteristics of amorphous indium gallium zinc oxide thin film transistors. Improvements in the field-effect mobility and the subthreshold swing demonstrate that interface states were passivated after N2O-plasma treatment, and a better stability under positive gate-bias stress was obtained in addition. The degradation of mobility, resulted from bias stress, reduces from 6.1% (untreated devices) to 2.6% (N2O-plasma treated devices). Nevertheless, a strange hump characteristic occurs in transfer curve during bias stress, inferring that a parasitic transistor had been caused by the gate-induced electrical field.
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