Concepedia
Journal of Alloys and Compounds · 2012 · 26 citations · 12 references
EngineeringMaterials EngineeringMaterials ScienceMechanical Behavior Of MaterialsMetallurgyAlloysMetallurgical ThermodynamicsMetalsPhysical MetallurgyPowder MetallurgyStrengthening MechanismsAnnealingAnnealing KineticsAnnealing Time EffectsManganese-based Intermetallics
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Self-forming diffusion barrier layer in Cu–Mn alloy metallization
Junichi Koike, M. Wada · Applied Physics Letters · 2005 · 262 citations · Full text
Engineering, Materials Engineering, Materials Science +17
Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions
Stephen W. Russell, S.A. Rafalski, R.L. Spreitzer et al. · Thin Solid Films · 1995 · 141 citations
Natural Sciences, Materials Engineering, Materials Science +16
Effects of the addition of small amounts of Al to copper: Corrosion, resistivity, adhesion, morphology, and diffusion
Peng Ding, W. A. Lanford, S. Hymes et al. · Journal of Applied Physics · 1994 · 134 citations
Natural Sciences, Materials Engineering, Materials Science +17
Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity
Katayun Barmak, Ali Güngör, C. Cabral et al. · Journal of Applied Physics · 2003 · 99 citations
Growth kinetics and thermal stability of a self-formed barrier layer at Cu-Mn∕SiO2 interface
Junichi Koike, M. Haneda, Jun Iijima et al. · Journal of Applied Physics · 2007 · 99 citations · Full text