Concepedia
Acta Materialia · 2010 · 67 citations · 25 references
Materials ScienceChemical EngineeringEngineeringCorrosionReaction ProcessReaction KineticsKinetics (Physics)Transformation KineticsChemical Kinetics
25
The kinetics of precipitation from supersaturated solid solutions
I.M. Lifshitz, V.V. Slyozov · Journal of Physics and Chemistry of Solids · 1961 · 8.2K citations
Materials Science, Engineering, Phase Equilibrium +5
Tin–lead (SnPb) solder reaction in flip chip technology
K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 587 citations
Materials Science, Engineering, Advanced Packaging (Semiconductors) +4
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations
Engineering, Mechanical Engineering, Chemistry +17
Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control
Matt Schaefer, R.A. Fournelle, Jin Liang · Journal of Electronic Materials · 1998 · 327 citations
Materials Engineering, Materials Science, Engineering +7
Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
Jianfeng Li, S.H. Mannan, M.P. Clode et al. · Acta Materialia · 2006 · 225 citations
Materials Science, Molten Sn–bi–x Solders, Interfacial Reactions +7