Effect of the pressure on the chemical vapor deposition of copper from copper hexafluoroacetylacetonate trimethylvinylsilane

Materials Research Society

Rustum Roy, H. J. Leamy, C. W. White et al. · Physics Today · 1984 · 1K citations

Natural Sciences, Materials Science, Physics +5

Mechanistic studies of copper thin-film growth from CuI and CuII .beta.-diketonates

Gregory S. Girolami, Patrick M. Jeffries, Lawrence H. Dubois · Journal of the American Chemical Society · 1993 · 129 citations

Natural Sciences, Chemistry, Materials Science +13

Chemical Vapor Deposition of Copper from Hexafluoroacetylacetonato Copper(I) Vinyltrimethylsilane: Deposition Rates, Mechanism, Selectivity, Morphology, and Resistivity as a Function of Temperature and Pressure

Ajay K. Jain, K. ‐M., Toivo T. Kodas et al. · Journal of The Electrochemical Society · 1993 · 109 citations

Natural Sciences, Chemistry, Materials Science +16

Copper-Based Metallization in ULSI Structures: Part II: Is Cu Ahead of Its Time as an On-Chip Interconnect Material?

Jian Li, T. E. Seidel, Jim W. Mayer · MRS Bulletin · 1994 · 103 citations

Engineering, Materials Engineering, Materials Science +17

The materials research society

Robert P. H. Chang · Advanced Materials · 1990 · 88 citations

Natural Sciences, Materials Engineering, Materials Science +4