Electromigration performance of Through Silicon Via (TSV) – A modeling approach

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang et al. · IEEE Transactions on Advanced Packaging · 2009 · 295 citations

Engineering, Materials Engineering, Materials Science +16

Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

Xi Liu, Qiao Chen, Pradeep Dixit et al. · 2009 · 172 citations

Engineering, Electrical Engineering, Materials Engineering +17

A study of thermo-mechanical stress and its impact on through-silicon vias

N. Ranganathan, K. Prasad, N. Balasubramanian et al. · Journal of Micromechanics and Microengineering · 2008 · 169 citations

Engineering, Electrical Engineering, Materials Science +17

Development of 3-D Silicon Module With TSV for System in Packaging

Navas Khan, V. S. Rao, Sharon Pei-Siang Lim et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 120 citations

Engineering, Electrical Engineering, Materials Engineering +17

Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation

David Dalleau, K. Weide-Zaage · Microelectronics Reliability · 2001 · 112 citations

Engineering, Materials Engineering, Materials Science +16