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Oxide Growth Rate Enhancement of Silicon Carbide (0001) Si-Faces in Thin Oxide Regime
46
Citations
17
References
2008
Year
Materials ScienceMaterials EngineeringEngineeringThermal Oxidation ProcessThin Oxide RegimeOxide ElectronicsOxidation ResistanceGrowth Rate EnhancementSurface ScienceApplied PhysicsSilicon CarbideSemiconductor Device FabricationSilicon On InsulatorCarbide
Thermal oxidation process of silicon carbide (SiC) has been studied by performing in-situ spectroscopic ellipsometry. In our previous work, we, for the first time, found that the growth rates of SiC(0001) C-face at oxidation thicknesses less than around 20 nm are much higher than those given by the Deal–Grove (D–G) model. In this report, we show that such a growth rate enhancement occurs also in the oxidation of SiC(0001) Si-face. By applying the empirical equation proposed by Massoud et al. [J. Electrochem. Soc. 132 (1985) 2685] to the oxidation of SiC Si-face and comparing the temperature and oxygen partial pressure dependences of oxidation rate parameters obtained with those for C-face, we discuss the difference in oxidation mechanism between SiC Si- and C-faces.
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