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Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle

Materials ScienceFlip ChipEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationContact AngleChip On BoardMechanical EngineeringApplied PhysicsSurface ScienceFabrication TechniqueSurface TensionChip AttachmentElectronic PackagingSoft Matter