Applied Physics Letters · 2008 · 120 citations · 7 references
Natural SciencesMaterials EngineeringMaterials ScienceCeramic MaterialsElectronic MaterialsThin FilmsAtomic Layer DepositionOxide SemiconductorsPerovskite MaterialsThin Film AnnealingThin Film Electrical PropertiesThin-film MaterialsAtomic Layer Deposition PrecursorsCurrent DensityDielectric ConstantDynamic Random-access MemoryElectrical PropertiesLeakage CurrentPerovskite OxidesThin Oxide Films
Sr Ti O 3 (STO) thin films were deposited at 370°C by atomic layer deposition using H2O as the oxidant, and Ti(O–iPr)2(thd)2 and Sr(thd)2 as Ti, and Sr precursors, respectively. Denser STO films were produced at this deposition temperature. The saturated growth rate was 0.15Å∕cycle. The adoption of a thin crystallized seed layer resulted in crystallized perovskite STO films at the as-deposited state without higher temperature post-annealing. A tox of 0.72nm (dielectric constant of 108) and a low leakage current density (∼10−7A∕cm2 at 0.8V) were obtained from a planar capacitor structure consisting of Pt∕20-nm-thick STO/Ru (bottom).
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Oh Seong Kwon, Sang Woon Lee, Jeong Hwan Han et al. · Journal of The Electrochemical Society · 2007 · 54 citations
Natural Sciences, Materials Engineering, Materials Science +17
Chang Seok Kang, Cheol Seong Hwang, Hag‐Ju Cho et al. · Japanese Journal of Applied Physics · 1996 · 52 citations
Natural Sciences, Materials Engineering, Materials Science +17