Experimental study of filling behaviors in the underfill encapsulation of a flip-chip - Concepedia

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Experimental study of filling behaviors in the underfill encapsulation of a flip-chip

20

Citations

15

References

2009

Year

Meng-Fu Shih, Wen‐Bin Young

Microelectronics Reliability

Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)MicrofabricationChip On BoardMechanical EngineeringUnderfill EncapsulationExperimental StudyChip AttachmentElectronic PackagingMicroelectronicsMolding (Process)

References

	Year	Citations

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