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Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength

Materials ScienceMaterials EngineeringEngineeringMicrofabricationThin Film ProcessingMechanical EngineeringApplied PhysicsMicrostructure-strength RelationshipSemiconductor Device FabricationSilicon Die StrengthElectronic PackagingSilicon On InsulatorMicroelectronicsBall-on-ring TestsMechanics Of MaterialsMicrostructureSilicon Debugging