Publication | Closed Access
Etch and strip induced material modification of porous low-k (k=2.2) dielectric
31
Citations
8
References
2004
Year
Materials EngineeringMaterials SciencePorous Low-kDielectricsEngineeringSurface ScienceApplied PhysicsMicrowave CeramicPlasma EtchingMaterial ModificationElectrical PropertyElectrical Insulation
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