Effect of structural changes of silica filler on the coefficient of thermal expansion (CTE) of underfill encapsulant

Materials science and engineering: An introduction

Clive R. Clayton · Materials Science and Engineering · 1987 · 6K citations

Natural Sciences, Materials Engineering, Materials Science +12

Study on mono-dispersed nano-size silica by surface modification for underfill applications

Yangyang Sun, Zhuqing Zhang, C.P. Wong · Journal of Colloid and Interface Science · 2005 · 232 citations

Natural Sciences, Materials Engineering, Materials Science +16

Comparative study of thermally conductive fillers in underfill for the electronic components

Woong Sun Lee, Jin Yu · Diamond and Related Materials · 2005 · 178 citations

Engineering, Materials Engineering, Materials Science +16

Microstructure characterization of mechanically activated hematite using XRD line broadening

Parviz Pourghahramani, Eric Forssberg · International Journal of Mineral Processing · 2006 · 132 citations

Engineering, Materials Engineering, Materials Science +5

Comparison of various milling technologies for grinding pharmaceutical powders

Mostafa Nakach, Jean‐René Authelin, Alain Chamayou et al. · International Journal of Mineral Processing · 2004 · 87 citations · Full text

Pharmacy, Manufacturing Engineering, Pharmaceutics +12