Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates

Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use

Toshikazu Shimizu, Haruo Ishikawa, Ikuo Ohnuma et al. · Journal of Electronic Materials · 1999 · 113 citations

Natural Sciences, Materials Engineering, Materials Science +14

Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment

John N. Lalena, Nancy F. Dean, Martin Weiser · Journal of Electronic Materials · 2002 · 98 citations

Engineering, Materials Engineering, Materials Science +12

Penetration of liquid metals into solid metals and liquid metal embrittlement

K. Ina, Hirokazu Koizumi · Materials Science and Engineering A · 2004 · 81 citations

Engineering, Materials Engineering, Materials Science +13

The wetting transition in high and low energy grain boundaries in the Cu(In) system

Boris B. Straumal, T. Muschik, W. Gust et al. · Acta Metallurgica et Materialia · 1992 · 80 citations

Natural Sciences, Materials Engineering, Materials Science +12

Tensile behavior of pb-sn solder/cu joints

Lenora Quan, D. R. Frear, D. Grivas et al. · Journal of Electronic Materials · 1987 · 76 citations

Natural Sciences, Materials Engineering, Materials Science +13