Hsin-Yi Chuang

Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates

Jenn‐Ming Song, Hsin-Yi Chuang, Zong-Mou Wu · Journal of Electronic Materials · 2006 · 113 citations

Natural Sciences, Materials Engineering, Materials Science +16

Thermal and Tensile Properties of Bi-Ag Alloys

Jenn‐Ming Song, Hsin-Yi Chuang, Tien-Xiang Wen · Metallurgical and Materials Transactions A · 2007 · 94 citations

Natural Sciences, Materials Engineering, Materials Science +10

Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties

Jenn‐Ming Song, Jian-Jhih Lin, Chi-Feng Huang et al. · Materials Science and Engineering A · 2007 · 64 citations

Natural Sciences, Materials Engineering, Materials Science +11

Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys

Jenn‐Ming Song, Chi-Feng Huang, Hsin-Yi Chuang · Journal of Electronic Materials · 2006 · 47 citations

Natural Sciences, Materials Engineering, Materials Science +14

Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications

Jenn‐Ming Song, Hsin-Yi Chuang, Zong-Mou Wu · Journal of Electronic Materials · 2007 · 32 citations

Natural Sciences, Materials Engineering, Materials Science +13