IEEE Transactions on Electron Devices · 2008 · 44 citations · 7 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationDevice ModelingIntegrated Circuit DesignSemiconductor Device MaterialsSemiconductor PhysicsWide-bandgap Semiconductor DevicesEpitaxial Thin FilmsEpitaxial Thin-film GrowthGate LeakageGate Oxide LeakageLeakage Current ModelingLeakage Current ReductionNumerical ModelingSubthreshold Leakage
This paper presents the development and demonstration of large-area 10-kV 4H-SiC DMOSFETs that maintain a classically stable low-leakage normally off subthreshold characteristic when operated at les200degC. This is achieved by an additional growth (epitaxial regrowth) of a thin epitaxial layer on top of already implanted p-well regions in conjunction with a N20-based gate oxidation process. Additionally, the design space of the DMOSFET structure was explored using analytical and numerical modeling together with experimental verification. The resulting 0.15-cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> active 0.43-cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> die DMOSFET with 10-kV breakdown provides I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DS</sub> = 8 A at a gate field of 3 MV/cm, along with a subthreshold current at V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GS</sub> = 0 V that decreases from 1 muA (6.7 muA/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> ) at 25degC to 0.4 muA (2.7 muA/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> ) at 200degC.
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The physics of semiconductor devices
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