Applied Physics Letters · 2006 · 318 citations · 14 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsSemiconductor Device MaterialsSemiconductor HeterostructuresSemiconductor PhysicsSemiconductor SurfacesThin Film Electrical PropertiesWide-bandgap Semiconductor DevicesElectron DensityHeterostructure DevicesHeterostructure Field-effect TransistorsHeterostructuresInterface Roughness ScatteringInterlayer MaterialsMetalorganic Vapor Phase EpitaxySheet Resistance
Room temperature electron mobility of 1170cm2∕Vs is obtained in an undoped, lattice-matched, Al0.82In0.18N∕GaN field-effect transistor heterostructure, while keeping a high (2.6±0.3)×1013cm−2 electron gas density intrinsic to the Al0.82In0.18N∕GaN material system. This results in a two-dimensional sheet resistance of 210Ω∕◻. The high mobility of these layers, grown by metal-organic vapor phase epitaxy on sapphire substrate, is obtained thanks to the insertion of an optimized AlN interlayer, reducing the alloy related interface roughness scattering.
14
Tomás Palacios, Siddharth Rajan, A. Chakraborty et al. · IEEE Transactions on Electron Devices · 2005 · 209 citations