Probing systems for dimensional micro- and nano-metrology

TLDR

Microsystems technology demands probing equipment with higher resolution and accuracy, creating challenges for both tactile and imaging‑based measurement approaches. The paper presents the challenges and demands of microsystems technology on probing systems and reviews practical approaches, their characteristics, and application limits. The authors discuss a top‑down miniaturization strategy for tactile probes and a bottom‑up approach using advanced microscopy to improve repeatability, linearity, and calibration.

Abstract

Quality control in the growing field of microsystems technology (MST) demands much higher resolution and accuracy of the testing equipment than conventional products. This is especially challenging in the field of probing. For tactile (i.e., contacting) measurement systems this is equivalent to a demand for miniaturization (in terms of form deviation and size of the contacting element, moving mass, probing force) and hence leads to a top down approach. Another approach is to qualify existing picturing microscopy techniques for three-dimensional measurements such as scanning probe microscopy and various optical microscopy techniques (bottom up approach) emphasizing the improvement of repeatability, linearity and calibration. The challenges and demands of micro systems technology on probing systems and different practical approaches for satisfying them will be presented with their special characteristics, fields and limits of application.