Implementation of carbon nanotube bundles in sub-5 micron diameter through-silicon-via structures for three-dimensionally stacked integrated circuits

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Natural Sciences, Electrical Engineering, Physics +13

The Doherty power amplifier

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Engineering, Communication, Electrical Engineering +17

Thermal Expansion of Single Wall Carbon Nanotubes

Hanqing Jiang, Binbin Liu, Yuli Huang et al. · Journal of Engineering Materials and Technology · 2004 · 312 citations

Natural Sciences, Materials Science, Physics +13

Electron Transport in Single-Walled Carbon Nanotubes

Paul L. McEuen, Ji‐Yong Park · MRS Bulletin · 2004 · 193 citations

Engineering, Materials Engineering, Materials Science +14

Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects

Nicolò Chiodarelli, Sugiura Masahito, Yusaku Kashiwagi et al. · Nanotechnology · 2011 · 114 citations

Engineering, Electrical Engineering, Materials Science +17