W. Steinhögl - Concepedia

Author

W. Steinhögl

Infineon Technologies (Germany)

Also Known As

W Steinhögl, W. Steinhogl, W. Steinhögl, Werner Steinhögl

Publications

2.2K

Citations

H-Index

Concepts

All Affiliations

Infineon Technologies (Germany)University of Vienna

About

W. Steinhögl is an author at Infineon Technologies (Germany) specializing in engineering, applied physics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	14	2.1K
2	Applied Physics	10	11	1.4K
3	Electrical Engineering	7	7	1.3K
4	Natural Sciences	4	4	115
5	Chemistry	2	2	43

W. Steinhögl

Publications

2.1K

Citations

H-Index

Page 1

	Year	Citations
Carbon nanotubes in interconnect applications Franz Kreupl, Anthony Graham, Georg S. Duesberg, Microelectronic Engineering Materials ScienceGraphene NanomeshesEngineeringCarbon-based MaterialNanomaterials	2002	628
Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller W. Steinhögl, G. Schindler, G. Steinlesberger, Journal of Applied Physics EngineeringComprehensive StudyResistorElectronic ConductorsNanoelectronics	2004	526
Size-dependent resistivity of metallic wires in the mesoscopic range W. Steinhögl, G. Schindler, G. Steinlesberger, Physical review. B, Condensed matter Electrical EngineeringMetallic WiresEngineeringPhysicsSpecific Resistance	2002	524
Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes G. Steinlesberger, M. Engelhardt, G. Schindler, Microelectronic Engineering Electrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)Nanoelectronics	2002	81
Tungsten interconnects in the nano-scale regime W. Steinhögl, G. Steinlesberger, Mathieu Perrin, Microelectronic Engineering Materials ScienceIi-vi SemiconductorEngineeringNanoelectronicsApplied Physics	2005	58
Angle-resolved study of magnetic dichroism in photoemission using linearly polarized light W. Kuch, Minn‐Tsong Lin, W. Steinhögl, Physical review. B, Condensed matter EngineeringMagnetic ResonanceAngle-resolved StudyMagnetization ReversalMagnetism	1995	53
Impact of line edge roughness on the resistivity of nanometer-scale interconnects W. Steinhögl, G. Schindler, G. Steinlesberger, Microelectronic Engineering Electrical EngineeringWafer Scale ProcessingEngineeringElectromigration TechniqueSpecific Resistance	2004	49
Electrical characterization of copper interconnects with end-of-roadmap feature sizes G. Schindler, G. Steinlesberger, M. Engelhardt, Solid-State Electronics Electrical EngineeringElectromigration TechniqueEngineeringNanoelectronicsElectrical Characterization	2003	42
Quasielastic helium atom scattering measurements of microscopic diffusion of CO on the Ni(110) surface M. F. Bertino, F. Hofmann, W. Steinhögl, The Journal of Chemical Physics Microscopic DiffusionEngineeringDiffusion ResistancePhysicsElectron Spectroscopy	1996	30
Phase analysis of TaN/Ta barrier layers in sub-micrometer trench structures for Cu interconnects M. Traving, I. Zienert, Ehrenfried Zschech, Applied Surface Science Electrical EngineeringEngineeringTunneling MicroscopyInterconnect (Integrated Circuits)Applied Physics	2005	27

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