Lead-free 0201 manufacturing, assembly and reliability test results

Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints

Xin Deng, R. Sidhu, Peter M. Johnson et al. · Metallurgical and Materials Transactions A · 2005 · 173 citations

Natural Sciences, Materials Engineering, Materials Science +16

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Bob Willis · Microelectronics International · 2003 · 123 citations

Engineering, Materials Engineering, Electronic Materials +10

Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu

Yefeng Zheng, Craig Hillman, Patrick McCluskey · 2003 · 35 citations

Natural Sciences, Materials Engineering, Materials Science +16

Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA

Reza Ghaffarian · Microelectronics Reliability · 2003 · 20 citations

Engineering, Electrical Engineering, Heat Transfer +12

01005 SMT component assembly for wireless SIP modules

R. Jarvina, Stefan Greiner, Richard E. Warren · 2005 · 10 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17