Addition of N2 as a polymer deposition inhibitor in CH4/H2 electrocyclotron resonance plasma etching of Hg1−<i>x</i>Cd<i>x</i>Te

Abstract

An approach is presented which eliminates the problems caused by hydrocarbon polymer deposition in etching compound semiconductor with CH4/H2 based plasmas. We find that atomic nitrogen, created by the addition of N2 to the plasma, inhibits polymer deposition in the chamber and on the sample. Atomic nitrogen has several beneficial effects; the elimination of polymer precursors, the reduction of the atomic hydrogen concentration, and a potential increase of methyl radical concentration. It is also demonstrated that the addition of N2 to CH4/H2 based electrocyclotron resonance plasmas used to etch HgCdTe eliminates the roughness normally formed during etching.