Applied Physics Letters · 2006 · 94 citations · 16 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsAmorphous SemiconductorsDopingImplant MaterialsIon ImplantationSemiconductor DefectsSemiconductor Device MaterialsAmorphous RegionsEquilibrium SolubilityJunction ResistancePrecipitatesRapid Thermal AnnealingSheet ResistanceSolubilityThermal Annealing
Time evolution of the chemical profile, electrical activity, and regrowth of P implanted in Ge at a concentration above the maximum equilibrium solubility is investigated at 500°C rapid thermal annealing temperature. During the first anneal, a second, epitaxial regrowth of a part of the amorphous layer leads to P trapping in substitutional sites at a level of about 4×1020atoms∕cm3. However, nonsubstitutional P atoms frozen in the crystal at high concentration during recrystallization form large, inactive precipitates of peculiar circular shape. Simultaneously, long annealing time leads to continuing, extensive P out- and indiffusion affecting both the P chemical profile and junction sheet resistance.
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Germanium n-type shallow junction activation dependences
Chi On Chui, Leonard Kulig, Jean M. Moran et al. · Applied Physics Letters · 2005 · 177 citations