Publication | Closed Access
Characterization of silicon wafer bonding for Power MEMS applications
31
Citations
13
References
2002
Year
Electrical EngineeringWafer Scale ProcessingEngineeringMicrofabricationNanoelectronicsApplied PhysicsSilicon WaferSemiconductor Device FabricationElectronic PackagingSilicon On InsulatorMicroelectronics
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