Sputter-etching of Heterogeneous Surfaces

Abstract

In conventional sputter etching, heterogeneous surfaces are eroded at generally unpredictable rates. The reasons for this are discussed and a solution to the problem is given: Based on control of redeposition, the technique involves the use of a device called a “catcher,” which is placed near the target of the sputtering chamber to trap re-emitted particles. Experiments are described which confirm the effectiveness of the approach.