IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 19 citations · 13 references
EngineeringElectrical EngineeringMicroelectromechanical SystemsMicroelectronicsMicrowave EngineeringMems DesignMems PackagingMems SwitchesPiezoelectric ActuationPiezoelectric MaterialsRf MemsLiquid Crystal PolymersMicroelectromechanical SwitchesPhase ShiftersRadio Frequency Front EndsRf Mems Phase ShiftersRf Mems SwitchesRf Microelectromechanical SystemsWafer-level Packaging
This paper presents an X-band two-bit phase shifter that integrates single-pole four-throw (SP4T) piezoelectric microelectromechanical switches with a compact 3-D passive design on a liquid crystal polymer (LCP) organic substrate. The multilayer LCP process allows a low-cost and lightweight circuit that can easily be integrated with other radio frequency front-end components, such as an antenna, at the packaging level. By routing lines onto embedded multilayers, a 22.5% reduction in area is achieved. In addition, low-loss piezoelectric SP4T switches with a 7 V actuation voltage are used to switch between different phase delays. The phase shifter exhibits a loss of 0.75 dB/bit with 2.25° average phase error at 10 GHz.
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RF-system-on-package (SOP) for wireless communications
Kyutae Lim, S. Pinel, M.F. Davis et al. · IEEE Microwave Magazine · 2002 · 179 citations
Engineering, Electrical Engineering, Information Technology +17
Manos M. Tentzeris, J. Laskar, John Papapolymerou et al. · IEEE Transactions on Advanced Packaging · 2004 · 108 citations · Full text