Publication | Closed Access
Smooth n-type GaN surfaces by photoenhanced wet etching
152
Citations
13
References
1998
Year
Koh SolutionEngineeringElectron-beam LithographyGan SurfacesSurface ProcessingChemical EngineeringBeam LithographyPhotoenhanced WetMaterials EngineeringMaterials ScienceElectrical EngineeringAluminum Gallium NitrideMicroelectronicsPlasma EtchingRoom-temperature Photoelectrochemical WetMicrofabricationSurface ScienceApplied PhysicsGan Power DeviceOptoelectronics
A room-temperature photoelectrochemical wet etching process is described that produces smoothly etched GaN surfaces using KOH solution and Hg arc lamp illumination. Atomic force microscope measurements indicate a root-mean-square etched surface roughness of 1.5 nm, which compares favorably to the unetched surface roughness of approximately 0.3 nm. Etch rates of 50 nm/min were obtained using a KOH solution concentration of 0.02 M and an illumination intensity of 40 mW/cm2. It is shown that the smooth etching occurs under conditions of low KOH solution concentration and high light intensities, which result in a diffusion-limited etch process.
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