Publication | Closed Access
Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current
21
Citations
22
References
2010
Year
Electrical EngineeringElectromigration TechniqueEngineeringMicrofabricationStress-induced Leakage CurrentApplied PhysicsElectronic PackagingMicroelectronicsStress Relaxation BehaviorMicrostructureElectrical Insulation
| Year | Citations | |
|---|---|---|
Page 1
Page 1