Thermal investigation of LED array with multiple packages based on the superposition method

Fine structure of heat flow path in semiconductor devices: A measurement and identification method

Vladimı́r Székely, Tran Van Bien · Solid-State Electronics · 1988 · 437 citations

Engineering, Electrical Engineering, Materials Science +17

A new evaluation method of thermal transient measurement results

V. Székely · Microelectronics Journal · 1997 · 432 citations

Engineering, Computer Engineering, Heat Transfer +16

Thermal effects in packaging high power light emitting diode arrays

Adam Christensen, Samuel Graham · Applied Thermal Engineering · 2008 · 309 citations

Engineering, Electrical Engineering, Materials Science +16

On the representation of infinite-length distributed RC one-ports

Vladimı́r Székely · IEEE Transactions on Circuits and Systems · 1991 · 161 citations

Engineering, Electrical Engineering, Circuit Theory +15

Heat dissipation design and analysis of high power LED array using the finite element method

Hui Huang Cheng, De-Shau Huang, Ming-Tzer Lin · Microelectronics Reliability · 2011 · 151 citations

Engineering, Computational Engineering, Mechanical Engineering +16