43
Publications
940
Citations
20
H-Index
2000
Active since
Shiwei Feng is an author at Beijing University of Technology specializing in engineering, applied physics, and electrical engineering.
Top concepts
EngineeringApplied PhysicsElectrical EngineeringMaterial ScienceMicroelectronicsHeat TransferOptoelectronicsThermal EngineeringElectronic Packaging3D Printing
Publications per year
2000–2024
43
43
Repeatedly Recyclable 3D Printing Catalyst‐Free Dynamic Thermosetting Photopolymers
Jingjing Cui, Fukang Liu, Zhe Lu et al. · Advanced Materials · 2023 · 57 citations
Dual-curing polymer systems for photo-curing 3D printing
Weizi Gao, Yunlong Guo, Jingjing Cui et al. · Additive manufacturing · 2024 · 48 citations
Ta/Au ohmic contacts to n-type ZnO
H. Sheng, Nuri W. Emanetoglu, Sriram Muthukumar et al. · Journal of Electronic Materials · 2003 · 47 citations
Nonalloyed Al ohmic contacts to MgxZn1−xO
H. Sheng, Nuri W. Emanetoglu, Sriram Muthukumar et al. · Journal of Electronic Materials · 2002 · 44 citations
Materials Engineering, Materials Science, Material Analysis +2
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