Electrodeposition Science and Technology in the Last Quarter of the Twentieth Century

Atomic Force Microscope

G. Binnig, C. F. Quate, Ch. Gerber · Physical Review Letters · 1986 · 14.4K citations · Full text

Natural Sciences, Materials Science, Physics +14

Advances in Electrochemistry and Electrochemical Engineering

Paul Delahay, Ashok K. Vijh · Journal of The Electrochemical Society · 1970 · 3.1K citations

Engineering, Chemical Engineering, Chemistry +12

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

Engineering, Materials Engineering, Materials Science +16

Kinetics of the Deposition of Inert Particles from Electrolytic Baths

N. Guglielmi · Journal of The Electrochemical Society · 1972 · 871 citations

Natural Sciences, Chemistry, Materials Science +17

Galvanostatic studies of the kinetics of deposition and dissolution in the copper + copper sulphate system

Einar Mattsson, J. O’M. Bockris · Transactions of the Faraday Society · 1959 · 488 citations

Natural Sciences, Chemistry, Materials Science +14