Transactions of The Japan Institute of Electronics Packaging · 2012 · 13 citations · 1 references
EngineeringComputational EngineeringMechanical EngineeringComputational Fluid DynamicsHeat TransferThermal AnalysisHeat Transfer AnalysisHeat Transfer ModelingThermal Boundary LayersThermal DesignThermal SimulationThermal StructureHeatIsothermal ProcessesStructure-function AnalysisThermal Device SimulationThermal Response AnalysisThermal-structural AnalysisThree-dimensional Heat ConductionThree-dimensional Heat Transfer
Thermal structure function is a proven methodology to do experiment based structural analysis of heat path inside electronics package or cooling devices. However, how to understand the 3D heat flux structure from a 1D structural function is always the most difficult job for thermal engineers. In this article, 3D CFD software is used to describe the transaction image from 1D structure function to 3D heat flux distribution.
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