Electronics Letters · 2001 · 15 citations · 1 references
EngineeringElectrical EngineeringMaterials EngineeringOptoelectronicsPhotonicsSemiconductor DevicesEtching ProcessesHigh-frequency Semiconductor DevicesIntegrated Circuit DevicesSemiconductor Device MaterialsSemiconductor LasersThin Film EtchingDevice FabricationEtch ChemistryPower EnhancementYield Enhancement
Completely singlemode MBE-grown selectively oxidised InGaAs-VCSELs with aperture diameters of up to 14 µm have been fabricated using a self-aligned shallow surface etch. By choosing the growth position accordingly, a continuous variation of the aperture diameter across the wafer is achieved to optimise the surface etch to aperture diameter ratio. A record singlemode output power of 5.7 mW (30 dB SMSR) is obtained for a 5.8 µm-aperture diameter, 2.8 µm etch spot diameter device.
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