Deposition mechanism of MOCVD copper films in the presence of water vapor

Recent advances in epitaxy

E. Bauer, H. Poppa · Thin Solid Films · 1972 · 513 citations

Physics, Applied Physics, Multilayer Heterostructures +3

Interfacial reaction during metallization of cured polyimide: An XPS study

N. J. Chou, Chuanbing Tang · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1984 · 220 citations

Materials Science, Various Metal–polyimide Systems, Material Analysis +14

Selective electroless copper for VLSI interconnection

P.-L. Pai, C. H. Ting · IEEE Electron Device Letters · 1989 · 176 citations

Materials Science, Electrical Engineering, Electromigration Technique +15

Oxygen chemisorption and cuprous oxide formation on Cu(111): A high resolution EELS study

Lawrence H. Dubois · Surface Science · 1982 · 137 citations

Materials Science, Inorganic Chemistry, Copper Oxide Materials +10

Chemical Vapor Deposition of Copper from Copper (II) Hexafluoroacetylacetonate

D. Temple, Arnold Reisman · Journal of The Electrochemical Society · 1989 · 127 citations

Materials Science, Chemical Engineering, Ligand Decomposition +9