Concepedia
Materials Letters · 2003 · 134 citations · 4 references
Natural SciencesMaterials EngineeringMaterials ScienceCorrosion ScienceElectrochemistrySurface EngineeringElectrical ConductivityElectroless PlatingMetal FormingMetal StabilityCopper Electroless PlatingPlatingPlating Bath Stability
4
Modern Electroplating
Frederick A. Lowenheim, Ralph A. Schaefer · Journal of The Electrochemical Society · 1974 · 399 citations
Social Sciences, Communication, Electrochemistry +6
The Effect of Some Additives on Electroless Copper Deposition
Milan Paunović, Russ Arndt · Journal of The Electrochemical Society · 1983 · 65 citations
Natural Sciences, Chemistry, Materials Science +16
The Use of Organic Additives to Stabilize and Enhance the Deposition Rate of Electroless Copper Plating
L. N. Schoenberg · Journal of The Electrochemical Society · 1972 · 43 citations
Natural Sciences, Materials Engineering, Materials Science +15
Effects of Thiourea and Guanidine Hydrochloride on Electroless Copper Plating
Aina Hung · Journal of The Electrochemical Society · 1985 · 40 citations · Full text
Natural Sciences, Chemistry, Materials Science +12