Japanese Journal of Applied Physics · 2007 · 40 citations · 8 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsChemical Vapor DepositionDevice SimulationPhotovoltaic DevicesPhotovoltaic MaterialsSemiconductor HeterostructuresSolar CellsDevice FabricationFill FactorHeterojunction DevicesHeterojunction Solar CellsSiliconSilicon CarbideSilicon Solar CellsSolar Cell Fabrication
The n-type microcrystalline cubic silicon carbide (µc-3C–SiC:H) films were deposited by hot wire chemical vapor deposition (HWCVD) at a low substrate temperature (∼300 °C). Heterojunction silicon based photovoltaic devices were fabricated by depositing wide band gap n-type µc-3C–SiC thin films on p-type Si wafers, whose thickness and resistivity were 200 µm and 1–10 Ω cm, respectively. The silicon wafers were textured using alkaline etchant prior to the device fabrication. The photovoltaic parameters of a typical device were found to be Voc=560 mV, Jsc=35.0 mA/cm2, fill factor (F.F.) = 0.724, and η=14.20%. Numerical analysis was performed using automat for simulation of hetero structures (AFORS-HET), a one-dimensional device simulators to determine the probable cause of the changes in device parameters before and after the ageing of the filament.
8
24% efficient silicon solar cells
A. Wang, Jianhua Zhao, Martin A. Green · Applied Physics Letters · 1990 · 298 citations