Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints - Concepedia

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Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints

16

Citations

21

References

2004

Year

Y. L. Lin, Wei‐Chen Luo, Yuan Lin, Cheng–En Ho, C. R. Kao

Journal of Electronic Materials

Materials ScienceGold ThicknessFriction WeldingEngineeringFlip-chip Solder JointsCorrosionMechanical EngineeringApplied PhysicsSurface ScienceChip AttachmentSurface FinishElectronic PackagingSurface ProcessingMicrostructureMetal Processing

References

	Year	Citations

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